- 等離子體與樣品直接接觸，清洗效果好
- 氣體消耗量低、節約成本
- 無需真空腔體和真空泵
- 高性價比
- 可以選用多種氣體, O2,N2,Ar
- 自動清洗系統
- 等離子室優化設計
- 等離子體與樣品直接接觸，清洗效果好
- 氣體消耗量低、節約成本
- 無需真空腔體和真空泵
- 高性價比
- 可以選用多種氣體, O2,N2,Ar
- 自動清洗系統
- 等離子室優化設計
Specification
ITEM Specification Q’ty Remark
Dimension (mm) Approx. 800(W) x800(D) x 1,600(H) 1
Product Size /
Loading direction
Work max size 200*250mm
( 250mm Width direction. )
Plasma Method 1
Process Gas
Ar (Argon pu, rity more than 99.9%, 0~40 lpm)
O2 (Oxygen purity more than 99.9%, 0~200 sccm)
1
Process Spec. 1
Process Gap Min1~Max.4mm 1 After test.
Process Speed 10mm/s ~100mm/s ( 0.6m/min ~6m/min ) 1
Main Frame & Cover AL Profile, AL6061, SS41 1
AP Plasma Unit
-AP Plasma Module :
Electrode Headset : 200mm
Metal Body : Anodized Al
Gas : MFC (Ar, O2/N2)
-Power Supply :max. 300W
1
: 180~250W / 200mm
Use of RF power
in the process
Y-axis Un it 2
Control U nit
Step Motor
PLC
Drive, Touch monitor
Control
1
Machine Weight 150Kg
220V, phase 20 A (groun d)
Plamsa Head Manual height control
Auto actuator step motor operation
After plasma processs / Contact angle check
The product size can be
changed.
Power Specifications
Plasma treatment while transferring
the lower product.
(the appropriate Heigh 3m)
